Filipino-American League of Engineers and Architects (FALEA) has established the FALEA Scholarship Fund for the purpose of providing scholarship to Hawaii residents who are attending or planning to attend college/university on a full-time basis,and it will be limited only for Engineering, Surveying, and Architectural degrees.  Successful applicants will receive a grant in an amount to be determined by the Foundation based on finances and demonstrated student financial need.  A recipient can again apply for the scholarship grant for the next academic year.  The application deadline is postmarked no later than December 31, 2021. The selection committee will select the scholarship recipients no later than January 15, 2021. The scholarship checks and certificates will be mailed to the students no later than January 30, 2022.

The following criteria will be used in making the final selections for the scholarships:

1.  Academic Performance

High School and/or College Transcripts are used to determine academic performance.  Transcript must be submitted with application form.

2.  Personal Letter

An essay that will provide the applicants the opportunity to express themselves.  The essay must explain why the applicants are seeking scholarship, what extra curricular activities they have been involved, what positions they held in organizations or clubs, community service and other information that they feel might be helpful. Please explain what communities do your activity serve.

3.  Recommendation

A recommendation letter is required (use the attached Recommendation Form).  The recommendation shall be from any FALEA members, past employers, teachers or professors.

4.  Personal Photo

A personal photo preferably electronic file (in jpeg, tiff, pdf format) shall be emailed to to be used for publishing in the souvenir program. (Any picture submitted will be part of the foundation’s document and will not be returned)

Please email  for any questions about FALEAs scholarship program and for FALEAs scholarship application. Application materials, including forms, transcripts and recommendations must be postmarked no later than December 31, 2021.


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